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1. 导线（信道）：conduction (track) 2. 导线（体）宽度：conductor width 3. 导线距离：conductor spacing 4. 导线层：conductor layer 5. 导线宽度/间距：conductor line/space 6. 第一导线层：conductor layer No.1 7. 圆形盘：round pad 8. 方形盘：square pad 9. 菱形盘：diamond pad 10. 长方形焊盘：oblong pad 11. 子弹形盘：bullet pad 12. 泪滴盘：teardrop pad 13. 雪人盘：snowman pad 14. V形盘：V-shaped pad 15. 环形盘：annular pad 16. 非圆形盘：non-circular pad 17. 隔离盘：isolation pad 18. 非功能连接盘：monfunctional pad 19. 偏置连接盘：offset land 20. 腹（背）裸盘：back-bard land 21. 盘址：anchoring spaur 22. 连接盘图形：land pattern 23. 连接盘网格阵列：land grid array 24. 孔环：annular ring 25. 组件孔：component hole 26. 安装孔：mounting hole 27. 支撑孔：supported hole 28. 非支撑孔：unsupported hole 29. 导通孔：via 30. 镀通孔：plated through hole (PTH) 31. 余隙孔：access hole 32. 盲孔：blind via (hole) 33. 埋孔：buried via hole 34. 埋/盲孔：buried /blind via 35. 任意层内部导通孔：any layer inner via hole (ALIVH) 36. 全部钻孔：all drilled hole 37. 定位孔：toaling hole 38. 无连接盘孔：landless hole 39. 中间孔：interstitial hole 40. 无连接盘导通孔：landless via hole 41. 引导孔：pilot hole 42. 端接全隙孔：terminal clearomee hole 43. 准表面间镀覆孔：quasi-interfacing plated-through hole 44. 准尺寸孔：dimensioned hole 45. 在连接盘中导通孔：via-in-pad 46. 孔位：hole location 47. 孔密度：hole density 48. 孔图：hole pattern 49. 钻孔图：drill drawing 50. 装配图：assembly drawing 51. 印制板组装图：printed board assembly drawing 52. 参考基准：datum referan
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